Product Features
Arbitrary adjustment
Optimized overclocking and cooling system
5 re-optimization gives your workstation wisdom. One-button operation can handle complex tuning tasks to be dynamic
The approach optimizes key aspects of the system, providing overclocking and cooling profiles tailored for the computer.
The auto-tuning utility provides superior overclocking and cooling based on your system configuration.
The fans are muted during daily operations and provide better airflow when the system is exposed to CPU or GPU intensive work.
The stress test feature helps optimize and overclock for workloads with high CPU or memory requirements.
CPU performance speedup
Unleash the performance of your computer with the ASUS Smart Butler 3 generation app!
Intelligent Acceleration Processor (TPU) is our intelligent automatic
The system tunes the application to provide fine-tuning of voltage, monitoring system status,
and adjusting overclocking parameters for better performance.
Flagship performance
Make memory faster
The third-generation ASUS T-design uses a better tracking path to transmit signals in time series and significantly reduce crosstalk
Condition, strengthen memory stability and compatibility, support DDR4-4, memory speed above 133MHz.
Overclocking Design — ASUS PRO Clock II Overclocking Technology
The WS X299 PRO features a dedicated base frequency (BCLK) generator that extends CPU and memory overclocking margins.
This custom solution works in conjunction with the TPU to boost voltage and BCLK overclocking control, allowing you to use your own
For example, take advantage of the performance of Intel? CoreTM X-Series processors.
Support for multiple GPUs
The WS X299 PRO motherboard supports NVIDIA? SLITM and AMD CrossFireXTM 2/3-way configurations.
With multiple GPU settings, you can control new graphics technologies and drive games with performance above 4K.
Superior thermal design (flexible thermal control)
The WS X299 PRO is fully equipped with thermal control and can be set via Fan Xpert 4 or UEFI BIOS.
All interfaces can be configured to monitor the thermal sensor of the three user configurations and react accordingly.
Dissipate heat according to the workload. All can be easily managed with Fan Xpert 4 or UEFI.
High performance VRM heat sink
Designed for powerful Intel Core X-Series processors up to 18 cores, the WS X299 PRO is powered by
The thermal design ensures greater performance without CPU throttling issues. This innovative thermal design combines high
Performance VRM heat sink and metal fin array design for greater heat dissipation surface area, plus two
The heat sink and the connected heat pipe further enhance the heat dissipation performance, and the WS X299 PRO can handle it smoothly no matter how harsh the work.
Fast all-round connectivity
(Double built-in M.2 and M.2 heat sinks - better heat dissipation, liberating performance)
The WS X299 PRO features dual built-in M.2 slots, each running as PCI Express 3.0 X4
Provides ample 32Gbps bandwidth. Both slots are located under the X299 chipset and are covered by heat sinks.
By reducing the temperature of the disk drive by up to 20 ° C, peak performance can be achieved in a variety of situations.
VROC
Upgrade your RAID
Additional use of ASUS Hyper M.2 X16 card* to release WS X299 PRO virtual RAID on CPU (VROC)
Performance with four PCIe? 3.0 x16 M.2 disk drives for a total bandwidth of up to 128Gbps. Based on PCH
RAID arrays have bottlenecks on the DMI bus's 32Gbps cap, and VROC lets you configure data with CPU PCIe lanes
A faster bootable RAID array that eliminates the aforementioned limitations.
USB 3.1 Gen 2 front interface
Keeping pace with the times
The front USB 3.1 interface of the WS X299 PRO supports next-generation computer chassis and devices.
USB 3.1 Gen 2 Type-A and Type-C interfaces
Built-in USB 3.1 Gen 2 for 10Gbps speed
Equipped with backward compatible USB 3.1 Gen 2 Type-ATM and USB 3.1 Gen 2 Type-CTM interface for better connection flexibility and fast data transfer speeds of up to 10Gbps.
Dual Intel? Server Grade Gigabit LAN
The WS X299 PRO is equipped with a server-class dual Intel? Gigabit LAN to provide more reliable network quality.
Guaranteed lower CPU usage and temperature for superior performance and increased support for different operating systems. Double
The network interface also supports the grouping function that can be combined with the network link to improve the transmission capacity or the backup capability when the fault occurs.
Intel? CoreTM X Series Processors for LGA 2066 Slots
Intel Core X Series processors (6 cores or more): 4 channels (8-DIMM), 44/28 PCI Express 3.0/2.0 channels.
Intel Core X Series processor (4 cores): 2-channel (4-DIMM), 16 PCI Express 3.0/2.0 channels.
Intel? X299 Chipset
The Intel X299 chipset supports the LGA 2066 slot Intel Core X-Series processor.
It uses serial point-to-point connections to improve performance and increase bandwidth and stability. In addition,
The X299 supports 10 USB 3.1 Gen 1 interfaces, 8 SATA 6Gbps interfaces, and 32Gbps M.2 for faster data capture.
Technical Specifications
6 x USB 3.1 Gen 1 連接端口 (4 @后, , 2 @前)
英特爾? X299 芯片組 :
6 x USB 2.0 連接端口 (4 @后, , 2 @前)
ASMedia? USB 3.1 Gen 2 控制器 :
2 x USB 3.1 Gen 2 連接端口 (2 @后, , Type-A + USB Type-C)
ASMedia? USB 3.1 Gen 2 控制器 :
1 x USB 連接端口
支持 AMD 3路 CrossFireX? 技術(shù)
8 x DIMM, 容量可達(dá) 128GB, DDR4 4133(超頻)/3600(超頻)/2666/2400/2133 MHz Non-ECC, Un-buffered 內(nèi)存
英特爾? 酷睿? X-系列處理器(四核)
4 x DIMM, 容量可達(dá)64GB, DDR4 4133(超頻)/3600(超頻)/2666/2400/2133 MHz Non-ECC, Un-buffered內(nèi)存
支持Intel? Extreme Memory Profile (XMP) 技術(shù)
1 x M.2 Socket 3 插槽, 支持 M key, 2242/2260/2280/22110 類型存儲設(shè)備(PCIE 3.0 x 4模式)*1
1 x M.2 Socket 3 插槽, 支持 M key, 2242/2260/2280 類型存儲設(shè)備(SATA & PCIE 3.0 x 4模式)*2
1 x U.2 接口
6 x SATA 6Gb/s 接口
支持 Raid 0, 1, 5, 10
支持英特爾? 快速存儲技術(shù) 15
支持英特爾? 快速存儲技術(shù)企業(yè)版 5.1 (CPU RAID功能需安裝 X-系列6-核及以上處理器)
支持英特爾? 智能響應(yīng)技術(shù)
英特爾? 傲騰? 內(nèi)存技術(shù)
2 x PCIe 3.0 x16 (x16 模式)
1 x PCIe 3.0 x16 (x8 模式)
1 x PCIe 3.0 x16 (x4 模式)
1 x PCIe 3.0 x4 擴展卡插槽 (x4 模式)
28-Lane CPU-
1 x PCIe 3.0 x16 (x16 模式)
1 x PCIe 3.0 x16 (x8 模式)
1 x PCIe 3.0 x16 (x4 模式)
1 x PCIe 3.0 x4 擴展卡插槽 (x4 模式)
16-Lane CPU-
1 x PCIe 3.0 x16 (x8 模式)
2 x PCIe 3.0 x16 (x4 模式)
1 x PCIe 3.0 x4 擴展卡插槽 (x4 模式)
1 x USB 3.1 Gen 1 接口可擴展2 組外接式 USB 3.1 Gen 1 接口
1 x USB 2.0 接口可擴展2組外接式USB 2.0接口
1 x AAFP 前置音頻接針
1 x Aura 可編程燈帶接針
2 x M.2 Socket 3 插槽，
1 x Aura RGB 燈帶接針
6 x SATA 6Gb/s設(shè)備連接插座
1 x TPM 接針
2 x 中央處理器風(fēng)扇電源插槽
1 x VROC_HW_Key
1 x 24-pin EATX主板電源插槽
2 x 8-pin ATX 12V主板電源插槽
1 x Thunderbolt 排針
1 x 前面板接口
1 x 6-pin EZ_PLUG 電源接口
1 x MemOK!按鈕
1 x 溫度傳感器接口
1 x AUX panel 排針
1 x EZ XMP 開關(guān)
1 x AIO_水泵接口
1 x 電源開啟開關(guān)
1 x CPU 超壓跳線（CPU_OV）
1 x 清除CMOS按鈕
1 x 5-pin EXT_FAN（擴展風(fēng)扇）插座
1 x 串口連接插座（COM）
1 x Rear fan
1 x U.2 Connector (support U.2 NVMe device)
1 x PANEL2
1 x PUMP Fan connector
1 x PANEL1
4 x USB 3.1 Gen 1 接口
4 x USB 2.0 接口
2 x USB 3.1 Gen 2 (藍(lán)綠色)Type-A + USB Type-C
1 x 光纖S/PDIF數(shù)字音頻輸出接口
1 x USB BIOS Flashback? 按鈕
1 x 8聲道音頻接口
- 支持: 音頻接口檢測(Jack-detection), 多音源獨立輸出(Multi-Streaming)技術(shù), 前面板麥克風(fēng)音頻連接端口變換（Jack-Retasking）
- 前后耳機輸出阻抗感測
- 高品質(zhì) 120 dB 立體聲播放 輸出 (背部Line-out) 和 113 dB (Line-in)
- 內(nèi)部耳放提升耳機與揚聲器的音質(zhì)
音頻功能:
- DTS Connect
- DTS Headphone:X
- 音頻放大器：讓耳機和音箱還原出高質(zhì)量的聲音
- depop降噪電路：減少啟動造成的瞬間爆音
- 高品質(zhì)日系音頻電容：讓您享受清晰和高保真的音效。
左右聲道獨立布線，二邊都能輸出相同質(zhì)量的音效。
高品質(zhì)日系音頻電容：讓您享受清晰和高保真的音效。
12 英寸 x 9.6 英寸 ( 30.5 厘米 x 24.4 厘米 )
I/O擋板
6 x SATA 6.0Gb/s數(shù)據(jù)線
1 x 垂直 M.2 支架套件
1 x COM 數(shù)據(jù)線
1 x SLI 橋接器
1 x 3-路 SLI 橋接器
1 x 2-port USB 模塊
1 x 隨機 DVD
2 x M.2 螺絲
1 x Q-Connector
1 x RGB燈帶擴展線 (80 cm)
凈重: 4.59 Kg
毛重: 7.48 Kg
散裝(5合1)
凈重: 7.15 Kg
毛重: 8.94 Kg
*1 M.2_2 和 U.2 共享帶寬
*2 M.2_1 和 SAT6G_1 共享 SATA 帶寬
